Single Diamond Wire Saw

SVC100-35

This silicon ingot cutting wire saw utilizes a cutting tool known as a circular diamond wire loop. It is a single Diamond wire saw and in the same time endless wire saw which wire running in a single direction without the need for reversing.
The circular diamond wire enables high linear speeds, reaching even up to 60 m/s. As a result, it allows for fast cutting speeds during silicon rod cutting, while maintaining superior cutting surface quality.

Single Diamond Wire Saw Technical Specification

ParameterValue or Specification
1Maximum Workpiece Diameter (mm)350
2Maximum Workpiece Length (mm)1000
4Worktable Y-Axis Travel (mm)1000
5Worktable Z-Axis Travel (mm)350
10Maximum Diamond Wire Speed (m/s)84 (Max)
13Minimum Feed Increment X-Axis (mm)0.01
14Minimum Feed Increment Y-Axis (mm)0.01
15Repeat Positioning Accuracy X-Axis (mm)±0.02
16Repeat Positioning Accuracy Y-Axis (mm)±0.02
20Total Power Consumption (kW)3.5
21Power Supply (Three-phase Five-wire)AC380V 50Hz
22Air Supply (MPa)0.6
23Machine Size(mm)1955*2630*1860
24Machine weight(kg)3700

 

 


Comparison Between Diamond Band Saw and a Single Diamond Wire Saw

Aspect
Diamond Band Saw
Endless Diamond Wire Saw
Cutting Mechanism
Utilizes a continuous loop of diamond-coated band as the cutting tool.
Employs a continuous loop of diamond-coated wire as the cutting tool.
Cutting Speed
Generally slower cutting speed due to the movement of the band.
Faster cutting speed due to the continuous linear motion of the wire.
Kerf Width
Typically has a wider kerf width, leading to more material wastage.
Minimizes kerf width, resulting in minimal material wastage.
Cut Surface Quality
May require additional polishing steps to achieve a smooth finish.
Simultaneously cuts and polishes, ensuring a smooth and shiny surface.
Versatility
Suitable for basic cuts and straight lines.
Highly versatile, suitable for complex shapes and intricate designs.
Precision
Moderate precision; may not achieve intricate designs accurately.
Offers high precision, ideal for intricate graphite components.
Material Efficiency
Can be less material-efficient due to wider cuts.
Maximizes material efficiency with narrow cuts.
Dust Generation
Generates more dust, potentially requiring dust extraction systems.
Produces minimal dust, contributing to a cleaner working environment.
Application
Mainly used for simpler cutting tasks
Ideal for various cutting needs, especially intricate graphite parts.
Ideal Use Case
Basic straight cuts in graphite.
Precision cuts, intricate designs, and complex graphite components.

Check Other Silicon Rod Cutting Model: SGC45 

COMPARISON OF THE CUT SURFACE EFFECT

our diamond wire cutting and band saw cutting

 

Equipment Advantage

Precision Cropping and Seeding
Offers high-precision removal of head and tail sections and accurate segmentation of the ingot, which is crucial for high-quality wafer production
Wire Saw Cutting Machine
Endless Diamond Wire Technology
The use of a continuous diamond wire ensures efficient, consistent cuts with a significantly reduced risk of wire breakage compared to traditional methods
Less Edge Break and Better Cutting Surface
The diamond wire saw provides a superior cutting surface, resulting in fewer edge breaks and contributing to the overall quality of the wafers.
graphtie wire cut machinery
Reduced Material Waste
The small cutting wire minimizes kerf loss, optimizing material usage and reducing waste, which is cost-effective and environmentally friendly.
Improved Productivity
Streamlines the cropping and seeding process, facilitating quicker transition to wafer slicing, thus enhancing overall production efficiency.
Durability and Low Maintenance
Built with robust materials and designed for longevity, requiring minimal maintenance even in continuous production environments.
Enhanced Safety Features
Incorporates safety measures to protect operators, including automated shut-off sensors and protective barriers.

Customer Testimonials

Industry: Semiconductor Manufacturing
Our experience with the multi-wire diamond wire cutter has been transformative. the precision cuts have noticeably improved our wafer quality. The machine's stability and Siemens servo system truly set it apart. It's been a game-changer for our production line.
shine smart equipment
Mr Liu
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Frequently Asked Questions

What is the maximum size of ingot that the machine can handle?
The machine is designed to handle ingots up to 350 mm in diameter, accommodating a wide range of sizes for different industry needs.
How does the machine ensure the consistency of wafer thickness?
With our advanced tension control system accurate to ±0.1N and a high-precision servo system, the machine maintains a consistent cutting pressure, ensuring uniform wafer thickness.
What materials can this machine cut besides silicon?
The machine is versatile enough to cut a variety of materials, including but not limited to silicon, sapphire, and certain types of glass suitable for semiconductor and photovoltaic applications.
Can the cutting speed be adjusted according to different materials?
Yes, the cutting speed can be adjusted to suit different materials and cutting requirements, providing flexibility and control over the production process.
What kind of maintenance and servicing does the machine require?
The machine is designed for easy maintenance, with a robust construction that minimizes wear and tear. Regular servicing includes checking wire tension, inspecting the servo system, and cleaning the wire path.
Is training provided for operating the machine?
Yes, we provide comprehensive training for operators to ensure they can use the machine safely and efficiently, including handling the software and understanding the mechanics.
What is the lifespan of the cutting wire, and how is it replaced?
The lifespan of the cutting wire depends on usage and the materials being cut. We provide detailed instructions for wire replacement, and the machine is designed to make this process as straightforward as possible.
Does the machine come with a warranty or after-sales support?
Absolutely, the machine comes with a manufacturer's warranty, and we offer after-sales support to address any operational issues you may encounter.
Can the machine be integrated with existing production lines?
Yes, the machine is designed to be compatible with existing production lines and can be integrated to work in tandem with other manufacturing equipment.
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