SVC100-35

Single Diamond Wire Saw Technical Specification


	Parameter	Value or Specification
1	Maximum Workpiece Diameter (mm)	350
2	Maximum Workpiece Length (mm)	1000
4	Worktable Y-Axis Travel (mm)	1000
5	Worktable Z-Axis Travel (mm)	350
10	Maximum Diamond Wire Speed (m/s)	84 (Max)
13	Minimum Feed Increment X-Axis (mm)	0.01
14	Minimum Feed Increment Y-Axis (mm)	0.01
15	Repeat Positioning Accuracy X-Axis (mm)	±0.02
16	Repeat Positioning Accuracy Y-Axis (mm)	±0.02
20	Total Power Consumption (kW)	3.5
21	Power Supply (Three-phase Five-wire)	AC380V 50Hz
22	Air Supply (MPa)	0.6
23	Machine Size(mm)	195526301860
24	Machine weight(kg)	3700

Comparison Between Diamond Band Saw and a Single Diamond Wire Saw

Aspect	Diamond Band Saw	Endless Diamond Wire Saw
Cutting Mechanism	Utilizes a continuous loop of diamond-coated band as the cutting tool.	Employs a continuous loop of diamond-coated wire as the cutting tool.
Cutting Speed	Generally slower cutting speed due to the movement of the band.	Faster cutting speed due to the continuous linear motion of the wire.
Kerf Width	Typically has a wider kerf width, leading to more material wastage.	Minimizes kerf width, resulting in minimal material wastage.
Cut Surface Quality	May require additional polishing steps to achieve a smooth finish.	Simultaneously cuts and polishes, ensuring a smooth and shiny surface.
Versatility	Suitable for basic cuts and straight lines.	Highly versatile, suitable for complex shapes and intricate designs.
Precision	Moderate precision; may not achieve intricate designs accurately.	Offers high precision, ideal for intricate graphite components.
Material Efficiency	Can be less material-efficient due to wider cuts.	Maximizes material efficiency with narrow cuts.
Dust Generation	Generates more dust, potentially requiring dust extraction systems.	Produces minimal dust, contributing to a cleaner working environment.
Application	Mainly used for simpler cutting tasks	Ideal for various cutting needs, especially intricate graphite parts.
Ideal Use Case	Basic straight cuts in graphite.	Precision cuts, intricate designs, and complex graphite components.

Check Other Silicon Rod Cutting Model: SGC45

COMPARISON OF THE CUT SURFACE EFFECT

our diamond wire cutting and band saw cutting

Cutting Applications

Silicon Ingot Cropping

Single Diamond Wire Saw for Top &Tail Cut

Specifically designed to handle silicon ingots, this machine excels in the precise removal of head and tail sections of the rods.

Solar Silicon Cutting

Single Diamond Wire Saw for Brigde Cutting/Cropping

This machine have 1000 mm feed which can section the silicon rod automatically.

Semiconductor Silicon Processing

Single Diamond Wire Saw for Seeding

One of the key applications of this machine is its ability to perform seeding on segmented silicon rods

Equipment Advantage

Precision Cropping and Seeding

Offers high-precision removal of head and tail sections and accurate segmentation of the ingot, which is crucial for high-quality wafer production

Endless Diamond Wire Technology

The use of a continuous diamond wire ensures efficient, consistent cuts with a significantly reduced risk of wire breakage compared to traditional methods

Less Edge Break and Better Cutting Surface

The diamond wire saw provides a superior cutting surface, resulting in fewer edge breaks and contributing to the overall quality of the wafers.

Reduced Material Waste

The small cutting wire minimizes kerf loss, optimizing material usage and reducing waste, which is cost-effective and environmentally friendly.

Improved Productivity

Streamlines the cropping and seeding process, facilitating quicker transition to wafer slicing, thus enhancing overall production efficiency.

Durability and Low Maintenance

Built with robust materials and designed for longevity, requiring minimal maintenance even in continuous production environments.

Enhanced Safety Features

Incorporates safety measures to protect operators, including automated shut-off sensors and protective barriers.

Frequently Asked Questions

What is the maximum size of ingot that the machine can handle?

The machine is designed to handle ingots up to 350 mm in diameter, accommodating a wide range of sizes for different industry needs.

How does the machine ensure the consistency of wafer thickness?

With our advanced tension control system accurate to ±0.1N and a high-precision servo system, the machine maintains a consistent cutting pressure, ensuring uniform wafer thickness.

What materials can this machine cut besides silicon?

The machine is versatile enough to cut a variety of materials, including but not limited to silicon, sapphire, and certain types of glass suitable for semiconductor and photovoltaic applications.

Can the cutting speed be adjusted according to different materials?

Yes, the cutting speed can be adjusted to suit different materials and cutting requirements, providing flexibility and control over the production process.

What kind of maintenance and servicing does the machine require?

The machine is designed for easy maintenance, with a robust construction that minimizes wear and tear. Regular servicing includes checking wire tension, inspecting the servo system, and cleaning the wire path.

Is training provided for operating the machine?

Yes, we provide comprehensive training for operators to ensure they can use the machine safely and efficiently, including handling the software and understanding the mechanics.

What is the lifespan of the cutting wire, and how is it replaced?

The lifespan of the cutting wire depends on usage and the materials being cut. We provide detailed instructions for wire replacement, and the machine is designed to make this process as straightforward as possible.

Does the machine come with a warranty or after-sales support?

Absolutely, the machine comes with a manufacturer's warranty, and we offer after-sales support to address any operational issues you may encounter.

Can the machine be integrated with existing production lines?

Yes, the machine is designed to be compatible with existing production lines and can be integrated to work in tandem with other manufacturing equipment.

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