This is a story about silicon ingot manufacturing. Our valued client, a prominent semiconductor company, faced a unique challenge. They needed precise top-cuts from silicon ingots and a thin slice to support their detailed content analysis. First, they needed to remove the top of the silicon ingot, which was considered waste. then they aimed to obtain 2 mm thick silicon slices from the left body. However, they encountered several challenges with their current bandsaw method:

Challenges of  Silicon Ingot manufacturing

– Large Cutting Kerf:The bandsaw produced wide cuts, resulting in significant material waste due to a wide kerf.

– Silicon Edgebreak:Silicon ingots are delicate and tend to break when cut with traditional methods, causing material waste.

– Surface Marks:Bandsaw cuts left marks on the silicon ingot surfaces, impacting the quality of their flowing steps.

Solution

Our solution was designed to address these challenges:

– Machine Model: SVC150-35

– Cutting Method:Instead of bandsaws, we used the diamond wire loop, which significantly reduced kerf width, minimizing material waste.

– Enhanced Precision:The diamond wire ensured precise, clean cuts, reducing the risk of silicon ingot breakage during cutting.

Cutting Setup

Here’s what the setup included:

– Machine Model:SVC150-35

– Cutting Parameters:

– Wire Loop Linear Speed: 32m/s

– Cutting Feed Rate: 35 mm/min

Video link of the cutting process：

Results: Precision and Quality

silicon ingot top cut

Our solution brought about remarkable changes:

– Reduced Kerf Loss: The narrower kerf resulted in significantly less material waste, maximizing the utility of the silicon ingot.

– Enhanced Silicon Integrity:The diamond wire minimized breakage during cutting, ensuring the integrity of the material.

– Quality Surfaces: The silicon top-cuts featured smooth, mark-free surfaces, improving the quality of their analytical results.

The future of silicon ingot manufacturing is on the brink of a major transformation, with the introduction of the endless diamond wire cut method as a game-changer. This innovative approach is expected to redefine silicon ingot manufacturing, offering unparalleled precision and significantly reducing material waste. As the silicon ingot cutting industry continues to grow, the endless diamond wire cut technique is poised to become a pivotal tool, enhancing the efficiency and accuracy of silicon ingot cutting processes. This advancement in silicon ingot manufacturing not only aligns with the industry’s push towards more sustainable and cost-effective methods but also opens up new possibilities in the manufacturing of high-quality semiconductor components.