SGC45 silicon ingot cutting machine

SGC45

SGC45 is Optimized for the semiconductor industry, the 18 inch Silicon Ingot cutting machine is a dedicated device for cropping and seeding large monocrystalline silicon rods.
SGC45 is Equipped with an endless diamond wire cutting tool, it provides seamless, high-precision cuts for ingots up to 18 inches in diameter. Designed to facilitate the efficient preparation of ingots for further processing, it stands out for its precision, minimal kerf loss, and adaptability to handle substantial silicon rod sizes, making it a critical asset for manufacturers aiming for top-tier production standards.

Technical Specification

SGC45 Silicon Ingot Cutting Machine
ParameterValue or Specification
1Maximum Workpiece Diameter (mm)450
2Maximum Workpiece Length (mm)1500
4Worktable Y-Axis Travel (mm)400
5Worktable Z-Axis Travel (mm)500
10Maximum Diamond Wire Speed (m/s)36 (Max)
13Minimum Feed Increment X-Axis (mm)0.01
14Minimum Feed Increment Y-Axis (mm)0.01
15Repeat Positioning Accuracy X-Axis (mm)±0.02
16Repeat Positioning Accuracy Y-Axis (mm)±0.02
20Total Power Consumption (kW)3.5
21Power Supply (Three-phase Five-wire)AC220V 50Hz
22Air Supply (MPa)0.6
23Machine Size(mm)2000*1200*1800
24Machine weight(kg)1800

This device is a diamond cutting equipment specifically designed for the semiconductor and photovoltaic industries to do Silicon Ingot Cutting . The cutting tool used is the latest closed-loop diamond wire, capable of segmenting the silicon rod and taking slices/seeds after the cutting process.

SGC45 is designed for the cutting of 18-inch silicon rods, while a similar structure, SGC30, is suitable for cutting 12-inch silicon rods.

Compared to diamond band saws and traditional single-wire cutting devices, this circular or endless diamond wire cutting equipment exhibits a lower edge chipping rate, superior cutting surface quality, and reduced material wastage.

Silicon Ingot Cutting Equipment

Pre-shipment Client Acceptance Video


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Pictures of Success Silicon Ingot Cutting 

silicon ingot cutting wire saw.

 

Equipment Advantage

Specialization for Large Ingots
Specifically designed to handle 18-inch diameter, 1.5-meter-long monocrystalline silicon rods, making it ideal for processing large ingots which are common in the industry.
Precision Cropping and Seeding
Offers high-precision removal of head and tail sections and accurate segmentation of the ingot, which is crucial for high-quality wafer production
Wire Saw Cutting Machine
Endless Diamond Wire Technology
The use of a continuous diamond wire ensures efficient, consistent cuts with a significantly reduced risk of wire breakage compared to traditional methods
Less Edge Break and Better Cutting Surface
The diamond wire saw provides a superior cutting surface, resulting in fewer edge breaks and contributing to the overall quality of the wafers.
graphtie wire cut machinery
Reduced Material Waste
The small cutting wire minimizes kerf loss, optimizing material usage and reducing waste, which is cost-effective and environmentally friendly.
Improved Productivity
Streamlines the cropping and seeding process, facilitating quicker transition to wafer slicing, thus enhancing overall production efficiency.
Durability and Low Maintenance
Built with robust materials and designed for longevity, requiring minimal maintenance even in continuous production environments.
User-Friendly Interface
eatures an intuitive control panel for easy operation, allowing for quick setup and adjustments with minimal training.
Enhanced Safety Features
Incorporates safety measures to protect operators, including automated shut-off sensors and protective barriers.

Customer Testimonials

Industry: Semiconductor Manufacturing
Our experience with the diamond band saw has been transformative. the new silicon ingot cutting machine SGC45 cut our 18 inch silicon rod very nice. The machine's stability truely set it apart. It's been a game-changer for our production line.
shine smart equipment
Mr Liu
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Frequently Asked Questions

What is the maximum size of ingot that the machine can handle?
The machine is designed to handle ingots up to 450 mm in diameter, accommodating a wide range of sizes for different industry needs.
How does the machine ensure the consistency of wafer thickness?
With our advanced tension control system accurate to ±0.1N and a high-precision servo system, the machine maintains a consistent cutting pressure, ensuring uniform wafer thickness.
What materials can this machine cut besides silicon?
The machine is versatile enough to cut a variety of materials, including but not limited to silicon, sapphire, and certain types of glass suitable for semiconductor and photovoltaic applications.
Can the cutting speed be adjusted according to different materials?
Yes, the cutting speed can be adjusted to suit different materials and cutting requirements, providing flexibility and control over the production process.
What kind of maintenance and servicing does the machine require?
The machine is designed for easy maintenance, with a robust construction that minimizes wear and tear. Regular servicing includes checking wire tension, inspecting the servo system, and cleaning the wire path.
Is training provided for operating the machine?
Yes, we provide comprehensive training for operators to ensure they can use the machine safely and efficiently, including handling the software and understanding the mechanics.
What is the lifespan of the cutting wire, and how is it replaced?
The lifespan of the cutting wire depends on usage and the materials being cut. We provide detailed instructions for wire replacement, and the machine is designed to make this process as straightforward as possible.
Does the machine come with a warranty or after-sales support?
Absolutely, the machine comes with a manufacturer's warranty, and we offer after-sales support to address any operational issues you may encounter.
Can the machine be integrated with existing production lines?
Yes, the machine is designed to be compatible with existing production lines and can be integrated to work in tandem with other manufacturing equipment.
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