SGC45 Silicon Ingot Cutting Machine | ||
Parameter | Value or Specification | |
1 | Maximum Workpiece Diameter (mm) | 450 |
2 | Maximum Workpiece Length (mm) | 1500 |
4 | Worktable Y-Axis Travel (mm) | 400 |
5 | Worktable Z-Axis Travel (mm) | 500 |
10 | Maximum Diamond Wire Speed (m/s) | 36 (Max) |
13 | Minimum Feed Increment X-Axis (mm) | 0.01 |
14 | Minimum Feed Increment Y-Axis (mm) | 0.01 |
15 | Repeat Positioning Accuracy X-Axis (mm) | ±0.02 |
16 | Repeat Positioning Accuracy Y-Axis (mm) | ±0.02 |
20 | Total Power Consumption (kW) | 3.5 |
21 | Power Supply (Three-phase Five-wire) | AC220V 50Hz |
22 | Air Supply (MPa) | 0.6 |
23 | Machine Size(mm) | 2000*1200*1800 |
24 | Machine weight(kg) | 1800 |
This device is a diamond cutting equipment specifically designed for the semiconductor and photovoltaic industries to do Silicon Ingot Cutting . The cutting tool used is the latest closed-loop diamond wire, capable of segmenting the silicon rod and taking slices/seeds after the cutting process.
SGC45 is designed for the cutting of 18-inch silicon rods, while a similar structure, SGC30, is suitable for cutting 12-inch silicon rods.
Compared to diamond band saws and traditional single-wire cutting devices, this circular or endless diamond wire cutting equipment exhibits a lower edge chipping rate, superior cutting surface quality, and reduced material wastage.
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Pictures of Success Silicon Ingot Cutting