SFM 42390 - Multi Wire Saw For Silicon Wafering -Shine

Technical Specification

Item	Specification	Parameters
Performance	Stable Operating Linear Speed	≥2400 m/min
	Processing Capability	180mm x 180mm – 232mm x 232mm
	Workpiece Length	≤900mm x 1 piece or equal length spliced rod (monocrystalline)
	Main Rollers Number/Drive Power	3 rollers/80Kw, water-cooled
	Wire Rollers Number/Drive Power	2 axes/22Kw, water-cooled
	Roller Diameter x Length	190mm (3 rollers), rubber-coated 916mm, slotted 900mm
	Wire Running Method	Bidirectional/Unidirectional
	Wire Guide Wheels	160mm, total of 6 (3 on each side)
	Axis Distance	440mm (for 230mm x 230mm silicon wafers)
	Feed Speed	0~10mm/min
	Feed Slide Fast Movement Speed Range	30-500mm/min
	Feed Slide Slow Movement Speed Range	5~30mm/min
Performance	Worktable Feed Straightness	≤0.005mm/150mm
	Acceleration	Up to 10m/s^2
	Tension System	0-25N, fluctuation range ≤±0.1N
	Spindle Runout	≤3μm
	Main Roller (core) Runout	≤10μm
	Wire Unwinding/Winding Reel (including working area) Runout	≤20μm
	Wire Unwinding/Winding Reel Model and Maximum Wire Storage	PV600HD/100km (stroke 200mm)
	Cutting Fluid Tank Maximum Capacity	600L, maximum flow rate Max250L/min (directly below the cutting chamber)
	Cutting Fluid Pump Power	7.5KW
	Equipment Vibration Value	When running wire at 900m/min, the vibration of the cutting chamber main body, and bearing box ≤10gE
	Bearing Box Cooling Method	Internal circulation water cooling
	TTV	≤20μm

This Multi Wire Saw is used for:

It is a specialized precision cutting equipment for various hard and brittle materials such as silicon wafers, semiconductors, glass, etc. This machine adopts our company’s latest technology, featuring sensitive response and significantly reducing the risk of fine wire breakage.

Multi Wire Saw Main Features

1.High-speed cutting is realized, with a cutting speed of ≥2400 m/min and tension control accuracy of ±0.1N.

2.It adopts a complete Siemens/Huichuan servo system solution, achieving stable and high-precision cutting methods, producing silicon wafers, semiconductors, glass, and other materials that meet the requirements.

3.The wire collection and deployment sides introduce the shortest path into the cutting chamber, enabling bi-directional wire feeding.

4.The machine’s body is a cast piece, offering very high mechanical stability and thermal stability, thus ensuring the smoothness of the cutting process.

Cutting Applications

In the photovoltaic (PV) industry

Multi Wire Saw

This multi-wire diamond wire cutting machine is applied primarily to slice polycrystalline or monocrystalline silicon ingots into thin wafers, which are then used to manufacture solar cells.

In the semiconductor industry

Multi Wire Saw

The machine's role is to cut ultra-pure monocrystalline silicon ingots into. wafers that serve as the substrate for integrated circuits (ICs).

In the field of optoelectronics

Multi Wire Saw

The multi-wire diamond wire cutting machine finds a crucial application in the slicing of sapphire wafers. These sapphire wafers are also pivotal in the production of Radio Frequency Integrated Circuits (RFICs), laser diodes, and silicon-on-sapphire (SOS) semiconductor devices.

Equipment Advantage

High-Speed Cutting

The machine achieves wire speeds of over 2400 meters per minute, a remarkable feat that significantly enhances production throughput. Coupled with a tension control precision of ±0.1N, it ensures rapid processing without compromising on the quality of the cut.

Advanced Servo System

Equipped with a comprehensive Siemens/Huichuan servo system, the machine offers a robust and precise cutting operation. This state-of-the-art system facilitates stable and high-precision cutting techniques, capable of producing wafers and other materials like silicon for semiconductors and glass, all meeting stringent quality standards.

Optimized Wire Management

By incorporating the shortest path from the wire collection to deployment into the cutting chamber, the machine ensures efficient wire usage. The bi-directional wire feeding mechanism reduces the total wire needed and maximizes machine uptime.

Solid Machine Construction

The main body of the machine is constructed from a single cast piece, providing exceptional mechanical and thermal stability. This design feature is critical in maintaining the smoothness and consistency of the cutting process, directly influencing the precision of the end product.

Customer Testimonials

Industry: Semiconductor Manufacturing

Our experience with the multi-wire diamond wire cutter has been transformative. the precision cuts have noticeably improved our wafer quality. The machine's stability and Siemens servo system truly set it apart. It's been a game-changer for our production line.

Mr Liu

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Frequently Asked Questions

What is the maximum size of ingot that the machine can handle?

The machine is designed to handle ingots up to 232*232 mm in diameter, accommodating a wide range of sizes for different industry needs.

How does the machine ensure the consistency of wafer thickness?

With our advanced tension control system accurate to ±0.1N and a high-precision servo system, the machine maintains a consistent cutting pressure, ensuring uniform wafer thickness.

What materials can this machine cut besides silicon?

The machine is versatile enough to cut a variety of materials, including but not limited to silicon, sapphire, and certain types of glass suitable for semiconductor and photovoltaic applications.

Can the cutting speed be adjusted according to different materials?

Yes, the cutting speed can be adjusted to suit different materials and cutting requirements, providing flexibility and control over the production process.

What kind of maintenance and servicing does the machine require?

The machine is designed for easy maintenance, with a robust construction that minimizes wear and tear. Regular servicing includes checking wire tension, inspecting the servo system, and cleaning the wire path.

Is training provided for operating the machine?

Yes, we provide comprehensive training for operators to ensure they can use the machine safely and efficiently, including handling the software and understanding the mechanics.

What is the lifespan of the cutting wire, and how is it replaced?

The lifespan of the cutting wire depends on usage and the materials being cut. We provide detailed instructions for wire replacement, and the machine is designed to make this process as straightforward as possible.

Does the machine come with a warranty or after-sales support?

Absolutely, the machine comes with a manufacturer's warranty, and we offer after-sales support to address any operational issues you may encounter.

Can the machine be integrated with existing production lines?

Yes, the machine is designed to be compatible with existing production lines and can be integrated to work in tandem with other manufacturing equipment.

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